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US Patent Issued to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES on Aug. 4 for "Quantum device for forming an array of quantum dots and associated manufacturing method" (French Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,927, issued on Aug. 4, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris). "Quantum device for forming a... Read More


US Patent Issued to UNITED MICROELECTRONICS on Aug. 4 for "RRAM structure and fabricating method of the same" (Singaporean, Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,928, issued on Aug. 4, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "RRAM structure and fabricating method of the ... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "PCM device" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,929, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "PCM device" was invented by Chang-Chi... Read More


US Patent Issued to ASM IP Holding on Aug. 4 for "Method of selectively forming phosphorous-doped epitaxial material on a surface" (Belgian Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,931, issued on Aug. 4, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method of selectively forming phosphorous-doped epitaxial... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Semiconductor device structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,932, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device structure and ma... Read More


US Patent Issued to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES on Aug. 4 for "Method for the solid phase crystallisation of an amorphous layer" (French Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,933, issued on Aug. 4, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris). "Method for the solid phase c... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Fin structure with reduced defects and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,934, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Fin structure with reduced defects an... Read More


US Patent Issued to ASM IP Holding on Aug. 4 for "Method of depositing material and semiconductor devices" (Dutch, Belgian Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,935, issued on Aug. 4, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method of depositing material and semiconductor devices" ... Read More


US Patent Issued to KOKUSAI ELECTRIC on Aug. 4 for "Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,936, issued on Aug. 4, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Method of manufacturing semiconductor device, substrate processing a... Read More


US Patent Issued to SAMSUNG ELECTRONICS, Adeka on Aug. 4 for "Method of manufacturing semiconductor device" (South Korean, Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,937, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea) and Adeka Corp. (Tokyo). "Method of manufactu... Read More